The laser system is used for rapid splitting and separation on the assembly line, and uses non-destructive technology to split the cells into specified specifications.
· The horizontal reverse detection is judged by detecting the direction of the grid line;
· Feeding debris detection: 5 million pixels (conventional), can detect edge chipping and missing corners;
· Position information acquisition, the offset information (X,) is fed back to the laser system through the positioning of the silicon wafer, and the repeat cutting accuracy is ≤0.1mm for cutting position compensation;
· Quick product switching;
· Unqualified products can be quickly rejected.
|Capacity||7200 pieces/hour (whole piece)||cutting method||Galvo grooving + split cutting method|
|Failure Rate||≤1%||Laser wavelength||1064nm|