The laser system is used for rapid splitting and separation on the assembly line, and uses non-destructive technology to split the cells into specified specifications.

· The horizontal reverse detection is judged by detecting the direction of the grid line;

· Feeding debris detection: 5 million pixels (conventional), can detect edge chipping and missing corners;

· Position information acquisition, the offset information (X,) is fed back to the laser system through the positioning of the silicon wafer, and the repeat cutting accuracy is ≤0.1mm for cutting position compensation;

· Quick product switching;

· Unqualified products can be quickly rejected.