EN

Language selection:

中文简体 ENGLISH

This website uses cookies to enhance your visit experience. If you continue to browse this website, you agree to our use of cookies. For more cookie policies, please refer to the privacy policy of this website.Deny Accept all

Photovoltaic Field

Fully automatic ultra-fast nondestructive slicer

MORE >

99.5%


Yield(≥)

7200uph


Equipment Capacity

0.05%


Fragmentation rate(≤)

1%


Failure rate(<)

PERC laser grooving equipment

MORE >

7200uph


Equipment Capacity

150-250μm


Silicon wafer thickness

15μm


Image accuracy(≤)

0.03%


Fragmentation rate(<)